RCEP-NZRegional (RCEP)Active
Regional Comprehensive Economic Partnership Agreement - New Zealand
RCEP tariff schedule for New Zealand goods. Provides an alternative to AANZFTA preferences with full cumulation benefits across 15 member states.
Key Facts
Tariff Coverage
Approximately 90% of tariff lines; over 65% at zero duty, remainder phased over 20 years
Key Sectors
All major sectors: electronics, automotive, machinery, chemicals, textiles, agriculture, metals, energy, plastics
Rules of Origin
Product-Specific Rules per tariff line; RVC of 40% or CTC; full cumulation among all 15 RCEP members
Exclusions & Limitations
Country-specific exclusion lists. Japan excludes rice, beef/pork, wheat, dairy, sugar. Phase-out periods up to 20 years.
Member Countries (1)
🇳🇿
New Zealand
Products Under RCEP-NZ
Sample of HS codes with active preferential rates under this agreement.
| HS Code | Product | Rate |
|---|---|---|
| 84869021 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of chemical vapour deposition apparatus for semiconductor production | 0% |
| 84863030 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Chemical vapour deposition apparatus for flat panel display production; spinners for coating photosensitive emulsions on flat panel display substrates; apparatus for physical deposition on flat panel display substrates | 0% |
| 84863030 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Chemical vapour deposition apparatus for flat panel display production; spinners for coating photosensitive emulsions on flat panel display substrates; apparatus for physical deposition on flat panel display substrates | 0% |
| 84869039 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories; Parts and accessories; Of machines and apparatus for the manufacture of flat panel displays; Of apparatus for wet etching, developing, stripping or cleaning flat panel displays, other | 0% |
| 84869034 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of chemical vapour deposition apparatus for flat panel display production | 0% |
| 84864020 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semiconductors; automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices | 0% |
| 84864050 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles | 0% |
| 84864050 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles | 0% |
| 84862093 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers | 0% |
| 84869016 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of grinding, polishing and lapping machines for processing of semiconductor wafers | 0% |
| 84869016 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of grinding, polishing and lapping machines for processing of semiconductor wafers | 0% |
| 84869028 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers; of inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers | 0% |
| 84869028 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers; of inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers | 0% |
| 84862099 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories; Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits, other | 0% |
| 84864060 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles | 0% |
| 84869025 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories; Parts and accessories; Of machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits; Of spraying appliances for etching, stripping or cleaning semiconductor wafers; of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers; of dry etching patterns on semiconductor materials; Of dicing machines for scribing or scoring semiconductor wafers; of lasercutters for cutting tracks in semiconductor production by laser beam; of machines for bending, folding and straightening semiconductor leads, other | 0% |
| 84869026 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Tool holders and self-opening dieheads; workholders; dividing heads and other special attachments for machine-tools | 0% |
| 84869012 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of spin dryers for semiconductor wafer processing | 0% |
| 84869012 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Of spin dryers for semiconductor wafer processing | 0% |
| 84869014 | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories — Tool holders and self-opening dieheads; work holders; dividing heads and other special attachments for machine-tools | 0% |
Agreement Details
- Code
- RCEP-NZ
- Type
- Regional (RCEP)
- Signed
- 2020
- In Force Since
- 2022
- Current Tariff Period
- 01 April 2026 — 31 Maret 2027
- Status
- Active (1,000 product tariffs)
- Members
- 1 countries